Part 3D Model

$ 0.499

74HC365D,652 Datasheet PDF - Nexperia

Manufacturer:

Nexperia

Category:

Logic ICs

Case Package:

SOIC-16

Description:

IC BUFF DVR TRI-ST HEX 16SOIC

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

74HC365D,652 Datasheet (21 Pages)

Pinout Diagram on4 PageHot

Package Outline Dimension on15 Page 16 Page 17 Page

Part Numbering System on2 Page

74HC365D,652 Datasheet PDF (21 Pages)

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74HC365D,652 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

16 Pin

Case/Package

SOIC-16

Number of Channels

6 Channel

Number of Positions

16 Position

Operating Temperature (Max)

125 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2V ~ 6V

Supply Voltage (Max)

6 V

Supply Voltage (Min)

2 V

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74HC365D,652 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Cut Tape (CT)

Size-Length

10 mm

Size-Width

4 mm

Size-Height

1.45 mm

Operating Temperature

-40℃ ~ 125℃

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74HC365D,652 Environmental

74HC365D,652 Export Classifications

74HC365D,652 Function Overview

74HC365D,652 Documents

74HC365D,652 Datasheet

Nexperia

21 Pages / 0.31 MByte

74HC365D,652 Other Datasheet PDF

Nexperia

206 Pages / 0.21 MByte

74HC365D,652 Other References

Nexperia

1 Pages / 0.13 MByte

74HC365 Documents

74HC365 Datasheet PDF

Philips

Hex buffer/line driver 3-state

74HC365D,652 Datasheet PDF

NXP

* Inverting outputs * Input levels: * For 74HC365: CMOS level * For 74HC365: TTL level * Complies with JEDEC standard no. 7A * ESD protection: * HBM EIA/JESD22-A114-F exceeds 2000V * MM EIA/JESD22-A115-A exceeds 200V * Specified from -40℃ to +85℃ and from -40℃ to +125℃ * Multiple package options

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