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74LVC1G66GS,132 Datasheet PDF - NXP

Manufacturer:

NXP

Category:

Interface ICs

Case Package:

XFDFN-6

Description:

Translation - Voltage Levels 3ns 5.5V 0.25W(1/4W)

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Documentation:

74LVC1G66GS,132 Datasheet (25 Pages)

Pinout Diagram on3 PageHot

Package Outline Dimension on16 Page 17 Page 18 Page 19 Page 20 Page

Part Numbering System on1 Page 2 Page

74LVC1G66GS,132 Datasheet PDF (25 Pages)

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74LVC1G66GS,132 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Case/Package

XFDFN-6

Supply Current

200 µA

Number of Circuits

1 Circuit

Power Dissipation

250 mW

3dB Bandwidth

500 MHz

Power Dissipation (Max)

250 mW

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74LVC1G66GS,132 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Operating Temperature

-40℃ ~ 125℃ (TA)

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74LVC1G66GS,132 Environmental

74LVC1G66GS,132 Export Classifications

74LVC1G66GS,132 Function Overview

74LVC1G66GS,132 Documents

74LVC1G66GS,132 Datasheet

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