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74LVT16245BDGG,112 Datasheet PDF - NXP

Manufacturer:

NXP

Category:

Logic ICs

Case Package:

TSSOP-48

Description:

Bus XCVR Dual 16CH 3-ST 48Pin TSSOP Bulk

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3D Model

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Documentation:

74LVT16245BDGG,112 Datasheet (19 Pages)

Pinout Diagram on4 Page 5 Page 6 PageHot

Package Outline Dimension on12 Page 13 Page 14 Page 15 Page

Part Numbering System on2 Page

74LVT16245BDGG,112 Datasheet PDF (19 Pages)

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74LVT16245BDGG,112 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

48 Pin

Case/Package

TSSOP-48

Number of Channels

16 Channel

Power Dissipation

500 mW

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Power Dissipation (Max)

500 mW

Supply Voltage

2.7V ~ 3.6V

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74LVT16245BDGG,112 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Bulk

Size-Height

1.05 mm

Operating Temperature

-40℃ ~ 85℃

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74LVT16245BDGG,112 Environmental

74LVT16245BDGG,112 Documents

74LVT16245BDGG,112 Datasheet

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19 Pages / 0.24 MByte

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