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AM3352 Datasheet PDF - TI
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TI
Description:
Sitara Processor: ARM Cortex-A8, 1GB Ethernet, Display
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AM3352 Datasheet PDF
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AM3352 Datasheet PDF (249 Pages)
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AM3352 Environmental
AM3352 Function Overview
●The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Linux® and Android™ are available free of charge from TI.
●The AM335x microprocessor contain the subsystems shown in Figure 1-1 and a brief description of each follows:
●The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects.
●The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC.
● Up to 1-GHz Sitara™ ARM® Cortex®-A8 32-Bit
●RISC Processor
● NEON™ SIMD Coprocessor
● 32KB of L1 Instruction and 32KB of Data Cache
●With Single-Error Detection (Parity)
● 256KB of L2 Cache With Error Correcting Code
●(ECC)
● 176KB of On-Chip Boot ROM
● 64KB of Dedicated RAM
● Emulation and Debug - JTAG
● Interrupt Controller (up to 128 Interrupt
●Requests)
● On-Chip Memory (Shared L3 RAM)
● 64KB of General-Purpose On-Chip Memory
●Controller (OCMC) RAM
● Accessible to All Masters
● Supports Retention for Fast Wakeup
● External Memory Interfaces (EMIF)
● mDDR(LPDDR), DDR2, DDR3, DDR3L
●Controller:
● mDDR: 200-MHz Clock (400-MHz Data
●Rate)
● DDR2: 266-MHz Clock (532-MHz Data Rate)
● DDR3: 400-MHz Clock (800-MHz Data Rate)
● DDR3L: 400-MHz Clock (800-MHz Data
●Rate)
● 16-Bit Data Bus
● 1GB of Total Addressable Space
● Supports One x16 or Two x8 Memory Device
●Configurations
● General-Purpose Memory Controller (GPMC)
● Flexible 8-Bit and 16-Bit Asynchronous
●Memory Interface With up to Seven Chip
●Selects (NAND, NOR, Muxed-NOR, SRAM)
● Uses BCH Code to Support 4-, 8-, or 16-Bit
●ECC
● Uses Hamming Code to Support 1-Bit ECC
● Error Locator Module (ELM)
● Used in Conjunction With the GPMC to
●Locate Addresses of Data Errors from
●Syndrome Polynomials Generated Using a
●BCH Algorithm
● Supports 4-, 8-, and 16-Bit per 512-Byte
●Block Error Location Based on BCH
●Algorithms
● Programmable Real-Time Unit Subsystem and
●Industrial Communication Subsystem (PRU-ICSS)
● Supports Protocols such as EtherCAT®,
●PROFIBUS, PROFINET, EtherNet/IP™, and
●More
● Two Programmable Real-Time Units (PRUs)
● 32-Bit Load/Store RISC Processor Capable
●of Running at 200 MHz
● 8KB of Instruction RAM With Single-Error
●Detection (Parity)
● 8KB of Data RAM With Single-Error
●Detection (Parity)
● Single-Cycle 32-Bit Multiplier With 64-Bit
●Accumulator
● Enhanced GPIO Module Provides Shift-
●In/Out Support and Parallel Latch on
●External Signal
● 12KB of Shared RAM With Single-Error
●Detection (Parity)
● Three 120-Byte Register Banks Accessible by
●Each PRU
● Interrupt Controller (INTC) for Handling System
●Input Events
● Local Interconnect Bus for Connecting Internal
●and External Masters to the Resources Inside
●the PRU-ICSS
● Peripherals Inside the PRU-ICSS:
● One UART Port With Flow Control Pins,
●Supports up to 12 Mbps
● One Enhanced Capture (eCAP) Module
● Two MII Ethernet Ports that Support
●Industrial Ethernet, such as EtherCAT
● One MDIO Port
● Power, Reset, and Clock Management (PRCM)
●Module
● Controls the Entry and Exit of Stand-By and
●Deep-Sleep Modes
● Responsible for Sleep Sequencing, Power
●Domain Switch-Off Sequencing, Wake-Up
●Sequencing, and Power Domain Switch-On
●Sequencing
● Clocks
● Integrated 15- to 35-MHz High-Frequency
●Oscillator Used to Generate a Reference
●Clock for Various System and Peripheral
●Clocks
● Supports Individual Clock Enable and
●Disable Control for Subsystems and
●Peripherals to Facilitate Reduced Power
●Consumption
● Five ADPLLs to Generate System Clocks
●(MPU Subsystem, DDR Interface, USB and
●Peripherals [MMC and SD, UART, SPI, I2C],
●L3, L4, Ethernet, GFX [SGX530], LCD Pixel
●Clock)
● Power
● Two Nonswitchable Power Domains (Real-
●Time Clock [RTC], Wake-Up Logic
●[WAKEUP])
● Three Switchable Power Domains (MPU
●Subsystem [MPU], SGX530 [GFX],
●Peripherals and Infrastructure [PER])
● Implements SmartReflex™ Class 2B for
●Core Voltage Scaling Based On Die
●Temperature, Process Variation, and
●Performance (Adaptive Voltage Scaling
●[AVS])
● Dynamic Voltage Frequency Scaling (DVFS)
● Real-Time Clock (RTC)
● Real-Time Date (Day-Month-Year-Day of Week)
●and Time (Hours-Minutes-Seconds) Information
● Internal 32.768-kHz Oscillator, RTC Logic and
●1.1-V Internal LDO
● Independent Power-on-Reset
●(RTC_PWRONRSTn) Input
● Dedicated Input Pin (EXT_WAKEUP) for
●External Wake Events
● Programmable Alarm Can be Used to Generate
●Internal Interrupts to the PRCM (for Wakeup) or
●Cortex-A8 (for Event Notification)
● Programmable Alarm Can be Used With
●External Output (PMIC_POWER_EN) to Enable
●the Power Management IC to Restore Non-RTC
●Power Domains
● Peripherals
● Up to Two USB 2.0 High-Speed OTG Ports
●With Integrated PHY
● Up to Two Industrial Gigabit Ethernet MACs (10,
●100, 1000 Mbps)
● Integrated Switch
● Each MAC Supports MII, RMII, RGMII, and
●MDIO Interfaces
● Ethernet MACs and Switch Can Operate
●Independent of Other Functions
● IEEE 1588v2 Precision Time Protocol (PTP)
● Up to Two Controller-Area Network (CAN) Ports
● Supports CAN Version 2 Parts A and B
● Up to Two Multichannel Audio Serial Ports
●(McASPs)
● Transmit and Receive Clocks up to 50 MHz
● Up to Four Serial Data Pins per McASP Port
●With Independent TX and RX Clocks
● Supports Time Division Multiplexing (TDM),
●Inter-IC Sound (I2S), and Similar Formats
● Supports Digital Audio Interface
●Transmission (SPDIF, IEC60958-1, and
●AES-3 Formats)
● FIFO Buffers for Transmit and Receive (256
●Bytes)
● Up to Six UARTs
● All UARTs Support IrDA and CIR Modes
● All UARTs Support RTS and CTS Flow
●Control
● UART1 Supports Full Modem Control
● Up to Two Master and Slave McSPI Serial
●Interfaces
● Up to Two Chip Selects
● Up to 48 MHz
● Up to Three MMC, SD, SDIO Ports
● 1-, 4- and 8-Bit MMC, SD, SDIO Modes
● MMCSD0 has Dedicated Power Rail for
●1.8-V or 3.3-V Operation
● Up to 48-MHz Data Transfer Rate
● Supports Card Detect and Write Protect
● Complies With MMC4.3, SD, SDIO 2.0
●Specifications
● Up to Three I2C Master and Slave Interfaces
● Standard Mode (up to 100 kHz)
● Fast Mode (up to 400 kHz)
● Up to Four Banks of General-Purpose I/O
●(GPIO) Pins
● 32 GPIO Pins per Bank (Multiplexed With
●Other Functional Pins)
● GPIO Pins Can be Used as Interrupt Inputs
●(up to Two Interrupt Inputs per Bank)
● Up to Three External DMA Event Inputs that can
●Also be Used as Interrupt Inputs
● Eight 32-Bit General-Purpose Timers
● DMTIMER1 is a 1-ms Timer Used for
●Operating System (OS) Ticks
● DMTIMER4–DMTIMER7 are Pinned Out
● One Watchdog Timer
● SGX530 3D Graphics Engine
● Tile-Based Architecture Delivering up to 20
●Million Polygons per Second
● Universal Scalable Shader Engine (USSE) is
●a Multithreaded Engine Incorporating Pixel
●and Vertex Shader Functionality
● Advanced Shader Feature Set in Excess of
●Microsoft VS3.0, PS3.0, and OGL2.0
● Industry Standard API Support of Direct3D
●Mobile, OGL-ES 1.1 and 2.0, OpenVG 1.0,
●and OpenMax
● Fine-Grained Task Switching, Load
●Balancing, and Power Management
● Advanced Geometry DMA-Driven Operation
●for Minimum CPU Interaction
● Programmable High-Quality Image Anti-
●Aliasing
● Fully Virtualized Memory Addressing for OS
●Operation in a Unified Memory Architecture
● LCD Controller
● Up to 24-Bit Data Output; 8 Bits per Pixel
●(RGB)
● Resolution up to 2048 × 2048 (With Maximum 126-MHz Pixel Clock)
● Integrated LCD Interface Display Driver
●(LIDD) Controller
● Integrated Raster Controller
● Integrated DMA Engine to Pull Data from the
●External Frame Buffer Without Burdening the
●Processor via Interrupts or a Firmware Timer
● 512-Word Deep Internal FIFO
● Supported Display Types:
● Character Displays - Uses LIDD
●Controller to Program these Displays
● Passive Matrix LCD Displays - Uses LCD
●Raster Display Controller to Provide
●Timing and Data for Constant Graphics
●Refresh to a Passive Display
● Active Matrix LCD Displays - Uses
●External Frame Buffer Space and the
●Internal DMA Engine to Drive Streaming
●Data to the Panel
● 12-Bit Successive Approximation Register
●(SAR) ADC
● 200K Samples per Second
● Input can be Selected from any of the Eight
●Analog Inputs Multiplexed Through an 8:1
●Analog Switch
● Can be Configured to Operate as a 4-Wire,
●5-Wire, or 8-Wire Resistive Touch Screen
●Controller (TSC) Interface
● Up to Three 32-Bit eCAP Modules
● Configurable as Three Capture Inputs or
●Three Auxiliary PWM utputs
● Up to Three Enhanced High-Resolution PWM
●Modules (eHRPWMs)
● Dedicated 16-Bit Time-Base Counter With
●Time and Frequency Controls
● Configurable as Six Single-Ended, Six Dual-
●Edge Symmetric, or Three Dual-Edge
●Asymmetric Outputs
● Up to Three 32-Bit Enhanced Quadrature
●Encoder Pulse (eQEP) Modules
● Device Identification
● Contains Electrical Fuse Farm (FuseFarm) of
●Which Some Bits are Factory Programmable
● Production ID
● Device Part Number (Unique JTAG ID)
● Device Revision (Readable by Host ARM)
● Debug Interface Support
● JTAG and cJTAG for ARM (Cortex-A8 and
●PRCM), PRU-ICSS Debug
● Supports Device Boundary Scan
● Supports IEEE 1500
● DMA
● On-Chip Enhanced DMA Controller (EDMA) has
●Three Third-Party Transfer Controllers
●(TPTCs) and One Third-Party Channel Controller
●(TPCC), Which Supports up to 64
●Programmable Logical Channels and Eight
●QDMA Channels. EDMA is Used for:
● Transfers to and from On-Chip Memories
● Transfers to and from External Storage
●(EMIF, GPMC, Slave Peripherals)
● Inter-Processor Communication (IPC)
● Integrates Hardware-Based Mailbox for IPC and
●Spinlock for Process Synchronization Between
●Cortex-A8, PRCM, and PRU-ICSS
● Mailbox Registers that Generate Interrupts
● Four Initiators (Cortex-A8, PRCM, PRU0, PRU1)
● Spinlock has 128 Software-Assigned Lock Registers
● Security
● Crypto Hardware Accelerators (AES, SHA,
●RNG)
● Secure Boot
● Boot Modes
● Boot Mode is Selected Through Boot
●Configuration Pins Latched on the Rising Edge
●of the PWRONRSTn Reset Input Pin
● Packages:
● 298-Pin S-PBGA-N298 Via Channel Package
●(ZCE Suffix), 0.65-mm Ball Pitch
● 324-Pin S-PBGA-N324 Package
●(ZCZ Suffix), 0.80-mm Ball Pitch
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