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APTGF50H60T3G Datasheet PDF - Microsemi

Manufacturer:

Microsemi

Category:

IGBTs

Case Package:

SP-3

Description:

Trans IGBT Module N-CH 600V 65A 250000mW 32Pin Case SP-3

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Documentation:

APTGF50H60T3G Datasheet (1 Pages)

APTGF50H60T3G Datasheet PDF (1 Pages)

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APTGF50H60T3G Specifications

TYPE

DESCRIPTION

Mounting Style

Screw

Number of Pins

32 Pin

Case/Package

SP-3

Power Dissipation

250000 mW

Breakdown Voltage (Collector to Emitter)

600 V

Input Capacitance (Cies)

2.2nF @25V

Input Power (Max)

250 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-40 ℃

Power Dissipation (Max)

250000 mW

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APTGF50H60T3G Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

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APTGF50H60T3G Environmental

APTGF50H60T3G Documents

APTGF50H60T3G Datasheet

Microsemi

1 Pages / 0.3 MByte

APTGF50H60T3G Other Datasheet PDF

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7 Pages / 0.51 MByte

APTGF50H60T3G Product Catalog

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40 Pages / 4.07 MByte

APTGF50H60T3 Documents

APTGF50H60T3G Datasheet PDF

Microsemi

Trans IGBT Module N-CH 600V 65A 250000mW 32Pin Case SP-3

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