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ATA5577M233SC-DBQ Datasheet PDF - Microchip

Manufacturer:

Microchip

Case Package:

BUMP DIE/ WAFER (WB)

Description:

125kHz IDIC (330Bit, r/w, 330pF)

Pictures:

3D Model

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Product Pictures

Documentation:

ATA5577M233SC-DBQ Datasheet (47 Pages)

Package Outline Dimension on38 Page 40 Page 41 Page 42 Page 43 Page

Part Numbering System on36 Page 37 Page 38 Page

ATA5577M233SC-DBQ Datasheet PDF (47 Pages)

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ATA5577M233SC-DBQ Specifications

TYPE

DESCRIPTION

Frequency

100kHz ~ 150kHz

Case/Package

BUMP DIE/ WAFER (WB)

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ATA5577M233SC-DBQ Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Unknown

Operating Temperature

-40℃ ~ 85℃

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ATA5577M233SC-DBQ Environmental

ATA5577M233SC-DBQ Export Classifications

ATA5577M233SC-DBQ Function Overview

ATA5577M233SC-DBQ Documents

ATA5577M233SC-DBQ Datasheet

Microchip

47 Pages / 1.8 MByte

ATA5577M233SC-DBQ Other Datasheet PDF

Microchip

3 Pages / 0.06 MByte

ATA5577M233SC-DBQ Notice File

Microchip

3 Pages / 0.17 MByte

ATA5577M233 Documents

ATA5577M233SC-DBQ Datasheet PDF

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