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Part Datasheet Search > BJTs > NXP > BC868,115 Datasheet PDF
BC868,115
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BC868,115 Datasheet PDF (23 Pages)
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BC868,115 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Frequency
170 MHz
Number of Pins
3 Pin
Case/Package
SOT-89-3
Number of Positions
3 Position
Polarity
NPN
Power Dissipation
500 mW
Breakdown Voltage (Collector to Emitter)
20 V
Continuous Collector Current
2A
hFE Min
85 @500mA, 1V
hFE Max
50 @5mA, 10V
Input Power (Max)
1.2 W
DC Current Gain (hFE)
40
Operating Temperature (Max)
150 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
1.35 W

BC868,115 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Size-Length
4.6 mm
Size-Width
2.6 mm
Size-Height
1.6 mm
Operating Temperature
150℃ (TJ)

BC868,115 Documents

NXP
23 Pages / 1.14 MByte
NXP
206 Pages / 0.21 MByte
NXP
18 Pages / 0.94 MByte
NXP
72 Pages / 3.63 MByte
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