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BFG520,235 Datasheet PDF - NXP

Manufacturer:

NXP

Category:

BJTs

Case Package:

TO-253-4

Description:

Trans RF BJT NPN 15V 0.07A 300mW 4Pin(3+Tab) SOT-143B T/R

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

BFG520,235 Datasheet (14 Pages)

Pinout Diagram on2 PageHot

Package Outline Dimension on11 Page

BFG520,235 Datasheet PDF (14 Pages)

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BFG520,235 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

4 Pin

Case/Package

TO-253-4

Power Dissipation

300 mW

Breakdown Voltage (Collector to Emitter)

15 V

hFE Min

60 @20mA, 6V

hFE Max

250

Input Power (Max)

300 mW

Operating Temperature (Max)

175 ℃

Operating Temperature (Min)

-65 ℃

Power Dissipation (Max)

300 mW

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BFG520,235 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Material

Silicon

Size-Height

1 mm

Operating Temperature

175℃ (TJ)

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BFG520,235 Environmental

BFG520,235 Function Overview

BFG520,235 Documents

BFG520,235 Datasheet

NXP

14 Pages / 0.3 MByte

BFG520,235 Other Datasheet PDF

NXP

26 Pages / 0.29 MByte

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