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Part Datasheet Search > BJTs > NXP > BFG520/X,235 Datasheet PDF
BFG520/X,235
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BFG520/X,235 Datasheet PDF (14 Pages)
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BFG520/X,235 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
4 Pin
Case/Package
TO-253-4
Power Dissipation
300 mW
Breakdown Voltage (Collector to Emitter)
15 V
hFE Min
60 @20mA, 6V
Input Power (Max)
300 mW
Operating Temperature (Max)
175 ℃
Operating Temperature (Min)
-65 ℃
Power Dissipation (Max)
300 mW

BFG520/X,235 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Material
Silicon
Operating Temperature
175℃ (TJ)

BFG520/X,235 Documents

NXP
14 Pages / 0.3 MByte
NXP
26 Pages / 0.29 MByte

BFG520 Documents

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