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BSP50,115 Datasheet PDF - NXP

Manufacturer:

NXP

Category:

BJTs

Case Package:

TO-261-4

Description:

SC-73 NPN 45V 1A

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

BSP50,115 Datasheet (7 Pages)

Pinout Diagram on2 PageHot

Package Outline Dimension on5 Page

BSP50,115 Datasheet PDF (7 Pages)

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BSP50,115 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-261-4

Number of Positions

3 Position

Polarity

NPN

Power Dissipation

1.25 W

Breakdown Voltage (Collector to Emitter)

45 V

Continuous Collector Current

hFE Min

2000 @500mA, 10V

hFE Max

1000

Input Power (Max)

1.25 W

DC Current Gain (hFE)

2000

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-65 ℃

Gain Bandwidth

200 MHz

Power Dissipation (Max)

1250 mW

View Datasheet >

BSP50,115 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Length

6.7 mm

Size-Width

3.7 mm

Size-Height

1.7 mm

Operating Temperature

150℃ (TJ)

View Datasheet >

BSP50,115 Environmental

BSP50,115 Function Overview

BSP50,115 Documents

BSP50,115 Datasheet

NXP

7 Pages / 0.11 MByte

BSP50,115 Other Datasheet PDF

NXP

206 Pages / 0.21 MByte

BSP50,115 Notice File

NXP

72 Pages / 3.63 MByte

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