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BSP61,115 Datasheet PDF - NXP

Manufacturer:

NXP

Category:

BJTs

Case Package:

TO-261-4

Description:

SC-73 PNP 60V 1A

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

BSP61,115 Datasheet (7 Pages)

Pinout Diagram on2 PageHot

Package Outline Dimension on5 Page

BSP61,115 Datasheet PDF (7 Pages)

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BSP61,115 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

4 Pin

Case/Package

TO-261-4

Number of Positions

4 Position

Polarity

PNP

Power Dissipation

1.25 W

Breakdown Voltage (Collector to Emitter)

60 V

Continuous Collector Current

hFE Min

2000 @500mA, 10V

Input Power (Max)

1.25 W

DC Current Gain (hFE)

1000

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-65 ℃

Gain Bandwidth

200 MHz

Power Dissipation (Max)

1.25 W

View Datasheet >

BSP61,115 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Length

6.7 mm

Size-Width

3.7 mm

Size-Height

1.7 mm

Operating Temperature

150℃ (TJ)

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BSP61,115 Environmental

BSP61,115 Function Overview

BSP61,115 Documents

BSP61,115 Datasheet

NXP

7 Pages / 0.11 MByte

BSP61,115 Other Datasheet PDF

NXP

206 Pages / 0.21 MByte

BSP61,115 Notice File

NXP

72 Pages / 3.63 MByte

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