Part 3D Model

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CC1111F16RSPR Datasheet - TI

Manufacturer:

Category:

RF Modules,ICs & Accessories

Case Package:

QFN-36

Description:

Sub-1GHz System-on-Chip with MCU, 16KB Flash memory and USB 2.0 36-VQFN 0 to 85

Pictures:

3D Model

Symbol

Footprint

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Product Pictures

Pages guide:

Typical Application Circuit Diagram onP40

Block Diagram onP33P41P141P170P211

Package Outline Dimension onP236P237P247P248

Package Footprint Pad Layout onP41

Part Numbering System onP239

Packaging Infomation onP239P247P248

Soldering Temperature onP7

Features Description onP1P5

Specifications onP7P9P244

Application Area onP1P249

Electrical Specification onP9

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CC1111F16RSPR Documents

CC1111F16RSPR Datasheet

249 Pages / 3.49 MByte

CC1111F16RSPR Other Datasheet PDF

8 Pages / 0.24 MByte

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CC1111F16 Datasheet PDF

Sub-1GHz System-on-Chip with MCU, 16KB Flash memory and USB 2.0

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CC1111F16RSPR Datasheet PDF

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CC1111F16RSPRG3 Datasheet PDF

Sub-1GHz System-on-Chip with MCU, 16KB Flash memory and USB 2.0 36-VQFN 0 to 85

CC1111F16RSPG3 Datasheet PDF

Sub-1GHz System-on-Chip with MCU, 16KB Flash memory and USB 2.0 36-VQFN 0 to 85

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