●Add Wi-Fi to low-cost, low-power microcontroller (MCU) for Internet of Things (IoT) applications. The CC3100MOD is FCC, IC, CE, and Wi-Fi CERTIFIED module is part of the new SimpleLink Wi-Fi family that dramatically simplifies the implementation of Internet connectivity. The CC3100MOD integrates all protocols for Wi-Fi and Internet, which greatly minimizes host MCU software requirements. With built-in security protocols, the CC3100MOD solution provides a robust and simple security experience. Additionally, the CC3100MOD is a complete platform solution including various tools and software, sample applications, user and programming guides, reference designs and the TI E2E support community. The CC3100MOD is available an LGA package that is easy to lay out with all required components including serial flash, RF filter, crystal, passive components fully integrated.
●The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-Chip and contains an additional dedicated ARM MCU that completely off-loads the host MCU. This subsystem includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The CC3100MOD module supports Station, Access Point, and Wi-Fi Direct modes. The module also supports WPA2 personal and enterprise security and WPS 2.0. This subsystem includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The power-management subsystem includes an integrated DC-DC converter with support for a wide range of supply voltages. This subsystem enables low-power consumption modes such as hibernate with RTC mode, which requires approximately 7 μA of current. The CC3100MOD module can connect to any 8-, 16-, or 32-bit MCU over the SPI or UART Interface. The device driver minimizes the host memory footprint requirements of less than 7KB of code memory and 700B of RAM memory for a TCP client application.
● The CC3100MOD is a Wi-Fi Module that Consists of the CC3100R11MRGC Wi-Fi Network Processor and Power-Management Subsystems. This Fully Integrated Module Includes all Required Clocks, SPI Flash, and Passives.
● Modular FCC, IC, and CE Certifications Save Customer Effort, Time, and Money
● Wi-Fi CERTIFIED Modules, With Ability to Request Certificate Transfer for Wi-Fi Alliance Members
● Wi-Fi Network Processor Subsystem
● Featuring Wi-Fi Internet-On-a-Chip
● Dedicated ARM MCU
●Completely Offloads Wi-Fi and Internet Protocols from the External Microcontroller
● Wi-Fi Driver and Multiple Internet Protocols in ROM
● 802.11 b/g/n Radio, Baseband, and Medium Access Control (MAC), Wi-Fi Driver, and Supplicant
● TCP/IP Stack
● Industry-Standard BSD Socket Application Programming Interfaces (APIs)
● 8 Simultaneous TCP or UDP Sockets
● 2 Simultaneous TLS and SSL Sockets
● Powerful Crypto Engine for Fast, Secure Wi-Fi and Internet Connections With 256-Bit AES Encryption for TLS and SSL Connections
● Station, AP, and Wi-Fi Direct Modes
● WPA2 Personal and Enterprise Security
● SimpleLink Connection Manager for Autonomous and Fast Wi-Fi Connections
● SmartConfig Technology, AP Mode, and WPS2 for Easy and Flexible Wi-Fi Provisioning
● TX Power
● 17 dBm at 1 DSSS
● 17.25 dBm at 11 CCK
● 13.5 dBm at 54 OFDM
● RX Sensitivity
● –94.7 dBm at 1 DSSS
● –87 dBm at 11 CCK
● –73 dBm at 54 OFDM
● Application Throughput
● UDP: 16 Mbps
● TCP: 13 Mbps
● Host Interface
● Wide Range of Power Supply (2.3 to 3.6 V)
● Interfaces With 8-, 16-, and 32-Bit MCU or ASICs Over a Serial Peripheral Interface (SPI) With up to 20-MHz Clock
● Low Footprint Host Driver: Less than 6KB
● Supports RTOS and No-OS Applications
● Power-Management Subsystem
● Integrated DC-DC Converter With a Wide-Supply Voltage:
● Direct Battery Mode: 2.3 to 3.6 V
● Low-Power Consumption at 3.6 V
● Hibernate With Real-Time Clock (RTC):
●7 μA
● Standby: 140 μA
● RX Traffic: 54 mA at 54 OFDM
● TX Traffic: 223 mA at 54 OFDM
● Integrated Components on Module
● 40.0-MHz Crystal With Internal Oscillator
● 32.768-kHz Crystal (RTC)
● 8-Mbit SPI Serial Flash RF Filter and Passive Components
● Package and Operating Conditions
● 1.27-mm Pitch, 63-Pin, 20.5-mm ×
●17.5-mm LGA Package for Easy Assembly and Low-Cost PCB Design
● Operating Temperature Range: –20°C to 70°C
