●The DAC8552 is a 16-bit, dual channel, voltage output digital-to-analog converter (DAC) offering low power operation and a flexible serial host interface. Each on-chip precision output amplifier allows rail-to-rail output swing to be achieved over the supply range of 2.7V to 5.5V. The device supports a standard 3-wire serial interface capable of operating with input data clock frequencies up to 30MHz for VDD = 5V.
●The DAC8552 requires an external reference voltage to set the output range of each DAC channel. Also incorporated into the device is a power-on reset circuit which ensures that the DAC outputs power up at zero-scale and remain there until a valid write takes place. The DAC8552 provides a flexible power-down feature, accessed over the serial interface, that reduces the current consumption of the device to 700nA at 5V.
●The low-power consumption of this device in normal operation makes it ideally suited for portable, battery-operated equipment and other low-power applications. The power consumption is 0.5mW per channel at 2.7V, reducing to 1µW in power-down mode.
●The DAC8552 is available in a MSOP-8 package with a specified operating temperature range of -40°C to +105°C.
● Relative Accuracy: 4LSB
● Glitch Energy: 0.15nV-s
● _Micro_Power Operation: 155µA per Channel at 2.7V
● Power-On Reset to Zero-Scale
● Power Supply: 2.7V to 5.5V
● 16-Bit Monotonic Over Temperature
● Settling Time: 10µs to ±0.003% FSR
● Ultra-Low AC Crosstalk: -100dB Typ
● Low-Power Serial Interface with Schmitt-Triggered Inputs
● On-Chip Output Buffer Amplifier with Rail-to-Rail Operation
● Double-Buffered Input Architecture
● Simultaneous or Sequential Output Update and Power-down
● Available in a Tiny MSOP-8 Package
● APPLICATIONS
● Portable Instrumentation
● Closed-Loop Servo Control
● Process Control
● Data Acquisition Systems
● Programmable Attenuation
● PC Peripherals
●SPI, QSP are trademarks of Motorola, Inc.
●Microwire is a trademark of National Semiconductor.
●All other trademarks are the property of their respective owners.
Part 3D Model
