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DHG60C600HB Datasheet PDF - IXYS Semiconductor

Manufacturer:

IXYS Semiconductor

Category:

Diode Arrays

Case Package:

TO-247-3

Description:

DIODE ARRAY 600V 30A TO247

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

DHG60C600HB Datasheet (3 Pages)

DHG60C600HB Specifications

TYPE

DESCRIPTION

Mounting Style

Through Hole

Number of Pins

3 Pin

Case/Package

TO-247-3

Forward Voltage

2.36V @30A

Reverse recovery time

35 ns

Maximum Forward Voltage (Max)

2.36V @30A

Forward Current (Max)

30 A

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

180000 mW

View Datasheet >

DHG60C600HB Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tube

Size-Width

5.3 mm

View Datasheet >

DHG60C600HB Environmental

DHG60C600HB Function Overview

DHG60C600HB Documents

DHG60C600HB Datasheet

IXYS Semiconductor

3 Pages / 0.08 MByte

DHG60C600HB Other Datasheet PDF

IXYS Semiconductor

4 Pages / 0.1 MByte

DHG60C600 Documents

DHG60C600HB Datasheet PDF

IXYS Semiconductor

DIODE ARRAY 600V 30A TO247

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