FEP30JP Datasheet PDF - Vishay Semiconductor

●FEATURES

●• Glass passivated chip junction

●• Ultrafast recovery time

●• Low switching losses, high efficiency

●• Low thermal resistance

●• High forward surge capability

●• Solder dip 260 °C, 40 s

●• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

●TYPICAL APPLICATIONS

●  For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, and other power switching application.