Part 3D Model

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HD6417750BP200M Datasheet PDF - Renesas Electronics

Manufacturer:

Renesas Electronics

Category:

Microcontrollers

Case Package:

BBGA-256

Description:

MCU 32Bit SuperH RISC ROMLess 1.95V 256Pin BGA

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

HD6417750BP200M User Reference Manual Guide (1132 Pages)

HD6417750BP200M Datasheet PDF (1132 Pages)

View Datasheet

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HD6417750BP200M Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

256 Pin

Supply Voltage (DC)

1.95 V, 2.07 V (max)

Case/Package

BBGA-256

Clock Speed

200 MHz, 200 MHz (max)

RAM Memory Size

24K x 8

Number of I/O Pins

20 IO

Access Time

200 µs

HD6417750BP200M Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Unknown

Packaging

Tray

Operating Temperature

-20℃ ~ 75℃ (TA)

HD6417750BP200M Environmental

HD6417750BP200M Documents

HD6417750BP200M User Reference Manual Guide

Renesas Electronics

1132 Pages / 6.36 MByte

HD6417750BP200M Other Datasheet PDF

Renesas Electronics

12 Pages / 1.71 MByte

HD6417750BP200 Documents

HD6417750BP200M Datasheet PDF

Renesas Electronics

MCU 32Bit SuperH RISC ROMLess 1.95V 256Pin BGA

HD6417750BP200MV Datasheet PDF

Renesas Electronics

MCU 32Bit SuperH RISC ROMLess 1.95V 256Pin BGA

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