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HGT1S20N60C3S9A Datasheet PDF - ON Semiconductor

Manufacturer:

ON Semiconductor

Case Package:

TO-263-3

Description:

Trans IGBT Chip N-CH 600V 45A 164000mW 3Pin(2+Tab) D2PAK T/R

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Documentation:

HGT1S20N60C3S9A Datasheet (8 Pages)

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HGT1S20N60C3S9A Datasheet PDF (8 Pages)

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HGT1S20N60C3S9A Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-263-3

Power Dissipation

164000 mW

Breakdown Voltage (Collector to Emitter)

600 V

Input Power (Max)

164 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

164000 mW

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HGT1S20N60C3S9A Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Operating Temperature

-55℃ ~ 150℃ (TJ)

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HGT1S20N60C3S9A Environmental

HGT1S20N60C3S9A Export Classifications

HGT1S20N60C3S9A Function Overview

HGT1S20N60C3S9A Documents

HGT1S20N60C3S9A Datasheet

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8 Pages / 0.13 MByte

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HGT1S20N60C3S9A Datasheet PDF

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