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Part Datasheet Search > RAM Memory > Integrated Silicon Solution(ISSI) > IS61WV25616BLL-10BLI Datasheet PDF
IS61WV25616BLL-10BLI
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IS61WV25616BLL-10BLI Datasheet PDF (21 Pages)
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IS61WV25616BLL-10BLI Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
48 Pin
Case/Package
BGA-48
Supply Current
45 mA
Number of Positions
48 Position
Number of Bits
16 Bit
Access Time
10 ns
Access Time(Max)
10 ns
Operating Temperature (Max)
85 ℃
Operating Temperature (Min)
-40 ℃
Supply Voltage
2.4V ~ 3.6V
Supply Voltage (Max)
3.6 V
Supply Voltage (Min)
2.4 V

IS61WV25616BLL-10BLI Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tray
Size-Length
8.1 mm
Size-Width
6.1 mm
Size-Height
0.9 mm
Operating Temperature
-40℃ ~ 85℃

IS61WV25616BLL-10BLI Documents

Integrated Silicon Solution(ISSI)
21 Pages / 0.2 MByte
Integrated Silicon Solution(ISSI)
2 Pages / 0.04 MByte
Integrated Silicon Solution(ISSI)
17 Pages / 0.77 MByte

IS61WV25616BLL10 Documents

Integrated Silicon Solution(ISSI)
4Mb, High-Speed/Low Power, Async, 256K x 16, 8ns/3.3V, or 10ns/2.4V-3.6V, 44Pin TSOP II, RoHS
Integrated Silicon Solution(ISSI)
4Mb, High-Speed/Low Power, Async, 256K x 16, 8ns/3.3V, or 10ns/2.4V-3.6V, 48 Ball mBGA (6x8 mm), RoHS
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-bit 256K x 16 10ns 44Pin TSOP-II
Integrated Silicon Solution(ISSI)
4Mb, High-Speed/Low Power, Async, 256K x 16, 8ns/3.3V, or 10ns/2.4V-3.6V, 44Pin TSOP II, Leadfree
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-bit 256K x 16 10ns 44Pin TSOP-II T/R
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-Bit 256K x 16 10ns 48Pin Mini-BGA T/R
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-Bit 256K x 16 10ns 48Pin Mini-BGA
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-Bit 256K x 16 10ns 44Pin SOJ
Integrated Silicon Solution(ISSI)
SRAM Chip Async Single 2.5V/3.3V 4M-Bit 256K x 16 10ns 44Pin SOJ T/R
Integrated Silicon Solution(ISSI)
TSOP44
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