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IXGF25N300 Datasheet PDF - IXYS Semiconductor

Manufacturer:

IXYS Semiconductor

Category:

IGBTs

Case Package:

i4-Pac

Description:

Trans IGBT Chip N-CH 3000V 27A 114000mW 3Pin ISOPLUS I4-PAC

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IXGF25N300 Datasheet PDF (2 Pages)

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IXGF25N300 Specifications

TYPE

DESCRIPTION

Mounting Style

Through Hole

Number of Pins

3 Pin

Case/Package

i4-Pac

Power Dissipation

114000 mW

Breakdown Voltage (Collector to Emitter)

3000 V

Input Power (Max)

114 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

114000 mW

IXGF25N300 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tube

Size-Height

20.88 mm

Operating Temperature

-55℃ ~ 150℃ (TJ)

IXGF25N300 Environmental

IXGF25N300 Function Overview

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2 Pages / 0.11 MByte

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IXGF25N300 Datasheet PDF

IXYS Semiconductor

Trans IGBT Chip N-CH 3000V 27A 114000mW 3Pin ISOPLUS I4-PAC

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