●The LAN8700C-AEZG is a low-power variable I/O voltage Analogue Interface IC with HP auto-MDIX support for high-performance embedded Ethernet applications. The LAN8700 can be configured to operate on a single 3.3V supply utilizing an integrated 3.3 to 1.8V linear regulator. An option is available to disable the linear regulator to optimize system designs that have a 1.8V power plane. The LAN8700 consists of an encoder/decoder, scrambler/descrambler, wave-shaping transmitter, output driver, twisted-pair receiver with adaptive equalizer and baseline wander (BLW) correction and clock and data recovery functions. The LAN8700 can be configured to support either the media independent interface (MII) or the reduced media independent interface (RMII). The LAN8700 is compliant with IEEE 802.3-2005 standards (MII Pins tolerant to 3.6V) and supports both IEEE 802.3-2005 compliant and vendor-specific register functions.
● Single-chip Ethernet physical layer transceiver (PHY)
● ESD protection levels of ±8kV HBM without external protection devices
● ESD protection levels of EN/IEC61000-4-2
● Comprehensive flexPWR® technology
● Flexible power management architecture
● +1.6 to +3.6V LVCMOS variable I/O voltage range
● Integrated 3.3V to 1.8V regulator for optional single supply operation
● Regulator can be disabled if 1.8V system supply
● Performs HP Auto-MDIX in accordance with IEEE 802.3ab specification
● Cable length greater than 150m
● Automatic polarity correction
● Latch-up performance exceeds 150mA per EIA/JESD 78, class II
● Energy detect power-down mode
● Low current consumption power-down mode
● Low operating current consumption
● 39mA Typical in 10BASE-T and 79mA typical in 100BASE-TX mode
● Supports auto-negotiation and parallel detection
● Supports the media independent interface (MII) and reduced media independent interface (RMII)
● Compliant with IEEE 802.3-2005 standards - MII pins tolerant to 3.6V
● IEEE 802.3-2005 compliant register functions
●ESD sensitive device, take proper precaution while handling the device.
Part 3D Model
