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Part Datasheet Search > Microcontrollers > NXP > LPC1113FHN33/302K Datasheet PDF
LPC1113FHN33/302K
$ 2.436
LPC1113FHN33/302K Datasheet PDF (127 Pages)
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LPC1113FHN33/302K Specifications

TYPE
DESCRIPTION
Number of Pins
33 Pin
Case/Package
VQFN-32
RAM Memory Size
8K x 8
Power Dissipation
1500 mW
FLASH Memory Size
24 kB
Number of ADCs
1 ADC
Operating Temperature (Max)
85 ℃
Operating Temperature (Min)
-40 ℃
Power Dissipation (Max)
1500 mW
Supply Voltage (Max)
3.6 V
Supply Voltage (Min)
1.8 V

LPC1113FHN33/302K Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tray
Weight
132.20547438 mg
Operating Temperature
-40℃ ~ 85℃

LPC1113FHN33/302K Documents

NXP
127 Pages / 2.53 MByte
NXP
128 Pages / 2.64 MByte
NXP
11 Pages / 0.38 MByte

LPC1113FHN33302 Documents

NXP
NXP LPC1113FHN33/302 32Bit Microcontroller, ARM Cortex-M0, 50MHz, 24KB, 8KB, 32Pins, HVQFN
NXP
NXP LPC1113FHN33/302,5 32Bit Microcontroller, ARM Cortex-M0, 50MHz, 24KB, 8KB, 33Pins, HVQFN
NXP
ARM Cortex-M0 LPC1100L Microcontroller IC 32Bit 50MHz 24KB (24K x 8) FLASH 32-HVQFN (7x7)
NXP
MCU 32Bit LPC1100L ARM Cortex M0 RISC 24KB Flash 3.3V 33Pin HVQFN EP Tray
NXP
MCU 32Bit LPC1100 ARM Cortex M0 RISC 24KB Flash 3.3V 32Pin HVQFN EP Tray
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