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Part Datasheet Search > Microprocessors > NXP > MPC860TZQ50D4R2 Datasheet PDF
MPC860TZQ50D4R2
$ 174.488
MPC860TZQ50D4R2 Datasheet PDF (89 Pages)
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MPC860TZQ50D4R2 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Frequency
50 MHz
Number of Pins
357 Pin
Case/Package
BGA-357
Halogen Free Status
Halogen Free
Power Dissipation
735 mW
Operating Temperature (Max)
95 ℃
Operating Temperature (Min)
0 ℃
Power Dissipation (Max)
735 mW

MPC860TZQ50D4R2 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Operating Temperature
0℃ ~ 95℃ (TA)

MPC860TZQ50D4R2 Documents

NXP
89 Pages / 1.49 MByte
NXP
640 Pages / 5.84 MByte
NXP
36 Pages / 0.93 MByte

MPC860TZQ50D4 Documents

Freescale
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA Tray
NXP
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA Tray
NXP
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA T/R
Freescale
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA T/R
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