Part 3D Model

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MR25H10CDF Datasheet PDF - Everspin Technologies

Manufacturer:

Everspin Technologies

Category:

Memory Chip

Case Package:

DFN-8

Description:

MR25H10 Series 1Mb 128K x 8 3V Serial SPI Surface Mount MRAM - DFN-8

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

MR25H10CDF Datasheet (21 Pages)

Pinout Diagram on2 Page 3 PageHot

Package Outline Dimension on17 Page 18 Page

Part Numbering System on16 Page

MR25H10CDF Datasheet PDF (21 Pages)

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MR25H10CDF Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

8 Pin

Case/Package

DFN-8

Supply Current

27 mA

Clock Speed

40 MHz

Power Dissipation

0.6 W

Access Time(Max)

10 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

Supply Voltage (Max)

3.6 V

Supply Voltage (Min)

2.7 V

View Datasheet >

MR25H10CDF Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tray

Operating Temperature

-40℃ ~ 85℃

View Datasheet >

MR25H10CDF Environmental

MR25H10CDF Export Classifications

MR25H10CDF Function Overview

MR25H10CDF Documents

MR25H10CDF Datasheet

Everspin Technologies

21 Pages / 1.79 MByte

MR25H10CDF Other Datasheet PDF

Everspin Technologies

2 Pages / 0.35 MByte

MR25H10CDF Features Description Parametrics

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20 Pages / 1.82 MByte

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