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Part Datasheet Search > RAM Memory > Micron > MT48LC2M32B2TG-7 IT G TR Datasheet PDF
MT48LC2M32B2TG-7 IT G TR
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MT48LC2M32B2TG-7 IT G TR Datasheet PDF (80 Pages)
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MT48LC2M32B2TG-7 IT G TR Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
86 Pin
Supply Voltage (DC)
3.30 V, 3.60 V (max)
Case/Package
TSOP
Supply Current
160 mA
Clock Speed
143MHz (max)
Access Time
143 µs
Memory Size
64000000 B

MT48LC2M32B2TG-7 IT G TR Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Unknown
Packaging
Tape & Reel (TR)

MT48LC2M32B2TG-7 IT G TR Documents

MT48LC2M32B2TG7 Documents

Micron
DRAM Chip SDRAM 64Mbit 2Mx32 3.3V 86Pin TSOP-II Tray
Micron
64Mb: x32 SDRAM
Micron
DRAM Chip SDRAM 64Mbit 2Mx32 3.3V 86Pin TSOP-II Tray
Micron
2MX32 SSDRAM PLASTIC IND TEMP TSOP 3.3V 143MHz
Micron
Ic Sdram 64Mbit 143MHz 86tsop - Mt48lc2m32b2tg-7: g Tr
Micron
IC SDRAM 64Mbit 143MHz 86TSOP
Micron
IC SDRAM 64Mbit 143MHz 86TSOP
Micron
DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86Pin TSOP-II T/R
Micron
The 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864Bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’s 67,108,864Bit banks is organized as 8192rows by 2048 columns by 4Bits. Each of the 16,777,216Bit banks is organized as 2048rows by 256 columns by 32Bits. Read and write accesses to the SDRAM are burst-oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA[1:0] select the bank; A[10:0] select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. The SDRAM provides for programmable read or write burst lengths (BL) of 1, 2, 4, or 8 locations, or the full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The 64Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a highspeed, fully random access. Precharging one bank while accessing one of the other three banks will hide the PRECHARGE cycles and provide seamless, high-speed, random- access operation. The 64Mb SDRAM is designed to operate in 3.3V memory systems. An auto refresh mode is provided, along with a power-saving, power-down mode. All inputs and outputs are LVTTL-compatible. SDRAM devices offer substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time, and the capability to randomly change column addresses on each clock cycle during a burst access.
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