MUR460-E3/54 Datasheet PDF - Vishay Semiconductor

●FEATURES

●• Glass passivated chip junction

●• Ultrafast reverse recovery time

●• Low forward voltage drop

●• Low leakage current

●• Low switching losses, high efficiency

●• High forward surge capability

●• Solder dip 260 °C, 40 s

●• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

●TYPICAL APPLICATIONS

●For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.