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NGTB03N60R2DT4G Datasheet PDF - ON Semiconductor

Manufacturer:

ON Semiconductor

Category:

IGBTs

Case Package:

TO-252-3

Description:

Trans IGBT Chip N-CH 600V 9A 49000mW 3Pin(2+Tab) DPAK T/R

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Documentation:

NGTB03N60R2DT4G Datasheet (8 Pages)

Package Outline Dimension on7 Page

Package Footprint Pad Layout on7 Page

Part Numbering System on1 Page 8 Page

NGTB03N60R2DT4G Datasheet PDF (8 Pages)

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NGTB03N60R2DT4G Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-252-3

Number of Positions

3 Position

Power Dissipation

49 W

Breakdown Voltage (Collector to Emitter)

600 V

Reverse recovery time

65 ns

Input Power (Max)

49 W

Operating Temperature (Max)

175 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

49000 mW

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NGTB03N60R2DT4G Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Length

6.73 mm

Size-Width

6.22 mm

Size-Height

2.38 mm

Operating Temperature

175℃ (TJ)

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NGTB03N60R2DT4G Environmental

NGTB03N60R2DT4G Export Classifications

NGTB03N60R2DT4G Function Overview

NGTB03N60R2DT4G Documents

NGTB03N60R2DT4G Datasheet

ON Semiconductor

8 Pages / 0.57 MByte

NGTB03N60R2DT4G Other Datasheet PDF

ON Semiconductor

11 Pages / 3.63 MByte

NGTB03N60R2DT4 Documents

NGTB03N60R2DT4G Datasheet PDF

ON Semiconductor

Trans IGBT Chip N-CH 600V 9A 49000mW 3Pin(2+Tab) DPAK T/R

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