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Part Datasheet Search > Interface ICs > NXP > SC16IS740IPW/Q900, Datasheet PDF
SC16IS740IPW/Q900,
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SC16IS740IPW/Q900, Datasheet PDF (158 Pages)
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SC16IS740IPW/Q900, Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
16 Pin
Case/Package
TSSOP-16
Supply Current
6 mA
Number of Channels
1 Channel
Number of Positions
16 Position
Power Dissipation
300 mW
Operating Temperature (Max)
95 ℃
Operating Temperature (Min)
-40 ℃
Power Dissipation (Max)
300 mW
Supply Voltage
2.5V, 3.3V
Supply Voltage (Max)
3.6 V
Supply Voltage (Min)
2.3 V

SC16IS740IPW/Q900, Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Operating Temperature
-40℃ ~ 95℃

SC16IS740IPW/Q900, Documents

NXP
158 Pages / 4.14 MByte
NXP
63 Pages / 0.53 MByte

SC16IS740 Documents

NXP
NXP SC16IS740IPW,112UART Interface, 1Channel, 5Mbps, 3V, 3.6V, TSSOP, 16Pins
NXP
16Bytes FIFO / DMA mode / HW & SW Flow Control[SC16C2550BIA44] UART 1CH 64Byte FIFO 2.5V/3.3V Automotive 16Pin TSSOP T/R
NXP
UART 1CH 64Byte FIFO 2.5V/3.3V Automotive 16Pin TSSOP T/R
NXP
UART 1CH 64Byte FIFO 2.5V/3.3V 16Pin TSSOP
NXP
IC UART SINGLE W/FIFO 16-TSSOP
NXP
UART Interface IC I2C/SPI-SLAVEBRIDGE W/IRDA
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