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Part Datasheet Search > IGBTs > Infineon > SGD02N60BUMA1 Datasheet PDF
SGD02N60BUMA1
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SGD02N60BUMA1 Datasheet PDF (12 Pages)
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SGD02N60BUMA1 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
3 Pin
Case/Package
TO-252-3
Power Dissipation
30000 mW
Breakdown Voltage (Collector to Emitter)
600 V
Input Power (Max)
30 W
Operating Temperature (Max)
150 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
30000 mW

SGD02N60BUMA1 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Not Recommended for New Designs
Packaging
Tape & Reel (TR)
Operating Temperature
-55℃ ~ 150℃ (TJ)

SGD02N60BUMA1 Documents

Infineon
12 Pages / 0.34 MByte
Infineon
270 Pages / 11.59 MByte
Infineon
73 Pages / 2.93 MByte
Infineon
48 Pages / 2 MByte

SGD02N60 Documents

Infineon
Trans IGBT Chip N-CH 600V 6A 30000mW 3Pin(2+Tab) DPAK T/R
Feeling
IGBT 600V 6A 30W TO252-3
Siemens Semiconductor
Insulated Gate Bipolar Transistor, 6A I(C), 600V V(BR)CES, N-Channel, TO-252AA
Infineon
Trans IGBT Chip N-CH 600V 6A 30000mW 3Pin(2+Tab) DPAK T/R
Infineon
Trans IGBT Chip N-CH 600V 6A 3Pin(2+Tab) TO-252
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