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SPC560B50L3B4E0Y Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Case Package:

QFP

Description:

32-bit Power Architecture MCU for Automotive Body and Gateway Applications

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

SPC560B50L3B4E0Y Application Note (116 Pages)

SPC560B50L3B4E0Y Datasheet PDF (116 Pages)

View Datasheet

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SPC560B50L3B4E0Y Specifications

TYPE

DESCRIPTION

Number of Pins

100 Pin

Case/Package

QFP

RAM Memory Size

32 KB

Number of ADCs

1 ADC

Operating Temperature (Max)

105 ℃

Operating Temperature (Min)

-40 ℃

SPC560B50L3B4E0Y Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Unknown

Packaging

Tray

SPC560B50L3B4E0Y Environmental

SPC560B50L3B4E0Y Documents

SPC560B50L3B4E0Y Application Note

ST Microelectronics

116 Pages / 2.23 MByte

SPC560B50L3B4E0 Documents

SPC560B50L3B4E0X Datasheet PDF

ST Microelectronics

MCU 32Bit SPC560B50x e200 RISC 512KB Flash 3.3V/5V Automotive 100Pin LQFP T/R

SPC560B50L3B4E0Y Datasheet PDF

ST Microelectronics

32-bit Power Architecture MCU for Automotive Body and Gateway Applications

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