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STGB30V60DF Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-263-3

Description:

Trans IGBT Chip N-CH 600V 60A 3Pin D2PAK T/R

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Documentation:

STGB30V60DF Datasheet (22 Pages)

Package Outline Dimension on11 Page 12 Page 13 Page 14 Page 15 Page

STGB30V60DF Datasheet PDF (22 Pages)

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STGB30V60DF Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-263-3

Breakdown Voltage (Collector to Emitter)

600 V

Reverse recovery time

53 ns

Input Power (Max)

258 W

Operating Temperature (Max)

175 ℃

Operating Temperature (Min)

-55 ℃

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STGB30V60DF Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Operating Temperature

-55℃ ~ 175℃ (TJ)

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STGB30V60DF Environmental

STGB30V60DF Export Classifications

STGB30V60DF Function Overview

STGB30V60DF Documents

STGB30V60DF Datasheet

ST Microelectronics

22 Pages / 1.86 MByte

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STGB30V60DF Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 60A 3Pin D2PAK T/R

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