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STGD5H60DF Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-252-3

Description:

Trans IGBT Chip N-CH 600V 10A 83000mW 3Pin(2+Tab) DPAK T/R

Pictures:

3D Model

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Product Pictures

Documentation:

STGD5H60DF Datasheet (30 Pages)

Package Outline Dimension on16 Page 17 Page 18 Page 19 Page 20 Page

STGD5H60DF User Reference Manual Guide (51 Pages)STGD5H60DF Application Note (35 Pages)

STGD5H60DF Datasheet PDF (30 Pages)

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STGD5H60DF Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Case/Package

TO-252-3

Number of Positions

3 Position

Power Dissipation

83 W

Breakdown Voltage (Collector to Emitter)

600 V

Reverse recovery time

134.5 ns

Input Power (Max)

83 W

Operating Temperature (Max)

175 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

83000 mW

View Datasheet >

STGD5H60DF Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Size-Length

6.6 mm

Size-Width

6.2 mm

Size-Height

2.4 mm

Operating Temperature

-55℃ ~ 175℃ (TJ)

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STGD5H60DF Environmental

STGD5H60DF Export Classifications

STGD5H60DF Function Overview

STGD5H60DF Documents

STGD5H60DF Datasheet

ST Microelectronics

30 Pages / 0.84 MByte

STGD5H60DF User Reference Manual Guide

ST Microelectronics

51 Pages / 2.12 MByte

STGD5H60DF Other Datasheet PDF

ST Microelectronics

17 Pages / 0.18 MByte

STGD5H60DF Application Note

ST Microelectronics

35 Pages / 2.4 MByte

STGD5H60 Documents

STGD5H60DF Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 10A 83000mW 3Pin(2+Tab) DPAK T/R

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