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STGD7NC60HT4 Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

TO-252-3

Description:

Trans IGBT Chip N-CH 600V 25A 70000mW 3Pin(2+Tab) DPAK T/R

Pictures:

3D Model

Symbol

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Pinout

Product Pictures

Documentation:

STGD7NC60HT4 Datasheet (12 Pages)

STGD7NC60HT4 Datasheet PDF (12 Pages)

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STGD7NC60HT4 Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

3 Pin

Voltage Rating (DC)

600 V

Current Rating

7.00 A

Case/Package

TO-252-3

Number of Positions

3 Position

Power Dissipation

70 W

Input Capacitance

720 pF

Rise Time

8.50 ns

Breakdown Voltage (Collector to Emitter)

600 V

Thermal Resistance

100 ℃/W

Input Power (Max)

70 W

Operating Temperature (Max)

150 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

70000 mW

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STGD7NC60HT4 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tape & Reel (TR)

Operating Temperature

-55℃ ~ 150℃ (TJ)

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STGD7NC60HT4 Environmental

STGD7NC60HT4 Export Classifications

STGD7NC60HT4 Function Overview

STGD7NC60HT4 Documents

STGD7NC60HT4 Datasheet

ST Microelectronics

12 Pages / 0.34 MByte

STGD7NC60HT4 Other Datasheet PDF

ST Microelectronics

17 Pages / 0.76 MByte

STGD7NC60HT4 Other References

ST Microelectronics

1 Pages / 0.13 MByte

STGD7NC60 Documents

STGD7NC60HT4 Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 25A 70000mW 3Pin(2+Tab) DPAK T/R

STGD7NC60H Datasheet PDF

ST Microelectronics

Trans IGBT Chip N-CH 600V 25A 3Pin (2+Tab) DPAK

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