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STGIPN3H60T-H Datasheet PDF - ST Microelectronics

Manufacturer:

ST Microelectronics

Category:

IGBTs

Case Package:

DIP-26

Description:

SLLIMM-nano small low-loss intelligent molded module IPM, 3A, 600V 3-phase IGBT inverter bridge

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

STGIPN3H60T-H Datasheet (25 Pages)

Pinout Diagram on4 PageHot

Package Outline Dimension on21 Page 22 Page 23 Page

STGIPN3H60T-H User Reference Manual Guide (51 Pages)STGIPN3H60T-H Application Note (84 Pages)

STGIPN3H60T-H Datasheet PDF (25 Pages)

View Datasheet

Click page to view the detail

STGIPN3H60T-H Specifications

TYPE

DESCRIPTION

Mounting Style

Through Hole

Number of Pins

26 Pin

Case/Package

DIP-26

Power Dissipation

8 W

Isolation Voltage

1000 Vrms

Operating Temperature (Max)

125 ℃

Operating Temperature (Min)

-40 ℃

Power Dissipation (Max)

8 W

View Datasheet >

STGIPN3H60T-H Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tube

Operating Temperature

-40℃ ~ 150℃

View Datasheet >

STGIPN3H60T-H Environmental

STGIPN3H60T-H Export Classifications

STGIPN3H60T-H Function Overview

STGIPN3H60T-H Documents

STGIPN3H60T-H Datasheet

ST Microelectronics

25 Pages / 1.09 MByte

STGIPN3H60T-H User Reference Manual Guide

ST Microelectronics

51 Pages / 2.12 MByte

STGIPN3H60T-H Other Datasheet PDF

ST Microelectronics

34 Pages / 0.43 MByte

STGIPN3H60T-H Application Note

ST Microelectronics

84 Pages / 4.95 MByte

STGIPN3H60T-H Features Description Parametrics

ST Microelectronics

16 Pages / 0.52 MByte

STGIPN3H60T-H Notice File

ST Microelectronics

8 Pages / 0.21 MByte

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