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Part Datasheet Search > IGBTs > ST Microelectronics > STGP30M65DF2 Datasheet PDF
STGP30M65DF2
$ 2.139
STGP30M65DF2 Datasheet PDF (17 Pages)
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STGP30M65DF2 Specifications

TYPE
DESCRIPTION
Mounting Style
Through Hole
Number of Pins
3 Pin
Case/Package
TO-220-3
Number of Positions
3 Position
Power Dissipation
258 W
Breakdown Voltage (Collector to Emitter)
650 V
Reverse recovery time
140 ns
Input Power (Max)
258 W
Operating Temperature (Max)
175 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
258 W

STGP30M65DF2 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tube
Size-Length
10.4 mm
Size-Width
4.6 mm
Size-Height
15.75 mm
Operating Temperature
-55℃ ~ 175℃ (TJ)

STGP30M65DF2 Documents

ST Microelectronics
17 Pages / 0.38 MByte
ST Microelectronics
16 Pages / 0.67 MByte

STGP30M65 Documents

ST Microelectronics
Trans IGBT Chip N-CH 650V 60A 258000mW 3Pin(3+Tab) TO-220 Tube
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