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Part Datasheet Search > IGBTs > ST Microelectronics > STGW30H60DFB Datasheet PDF
STGW30H60DFB
$ 2.524
STGW30H60DFB Datasheet PDF (18 Pages)
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STGW30H60DFB Specifications

TYPE
DESCRIPTION
Mounting Style
Through Hole
Number of Pins
3 Pin
Case/Package
TO-247-3
Number of Positions
3 Position
Power Dissipation
260 W
Breakdown Voltage (Collector to Emitter)
600 V
Reverse recovery time
53 ns
Input Power (Max)
260 W
Operating Temperature (Max)
175 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
260 W

STGW30H60DFB Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tube
Size-Length
15.75 mm
Size-Width
5.15 mm
Size-Height
20.15 mm
Operating Temperature
-55℃ ~ 175℃ (TJ)

STGW30H60DFB Documents

ST Microelectronics
18 Pages / 1.37 MByte
ST Microelectronics
18 Pages / 1.46 MByte
ST Microelectronics
30 Pages / 0.31 MByte

STGW30H60 Documents

ST Microelectronics
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Trans IGBT Chip N-CH 600V 60A 260000mW 3Pin(3+Tab) TO-247 Tube
ST Microelectronics
Trans IGBT Chip N-CH 600V 60A 260000mW 3Pin(3+Tab) TO-247 Tube
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