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Part Datasheet Search > IGBTs > ST Microelectronics > STGW50H60DF Datasheet PDF
STGW50H60DF
$ 5.191
STGW50H60DF Datasheet PDF (12 Pages)
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STGW50H60DF Specifications

TYPE
DESCRIPTION
Mounting Style
Through Hole
Number of Pins
3 Pin
Case/Package
TO-247-3
Power Dissipation
360 W
Breakdown Voltage (Collector to Emitter)
600 V
Reverse recovery time
55 ns
Input Power (Max)
360 W
Operating Temperature (Max)
150 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
360000 mW

STGW50H60DF Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tube
Operating Temperature
-55℃ ~ 150℃ (TJ)

STGW50H60DF Documents

ST Microelectronics
12 Pages / 1.71 MByte
ST Microelectronics
13 Pages / 1.69 MByte

STGW50H60 Documents

ST Microelectronics
Trans IGBT Chip N-CH 600V 100A 360000mW 3Pin(3+Tab) TO-247 Tube
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