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Part Datasheet Search > Interface ICs > NXP > TDA8024T/C1,118 Datasheet PDF
TDA8024T/C1,118
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TDA8024T/C1,118 Datasheet PDF (29 Pages)
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TDA8024T/C1,118 Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
28 Pin
Supply Voltage (DC)
2.70V (min)
Case/Package
SOIC-28
Number of Positions
28 Position
Power Dissipation
560 mW
Operating Temperature (Max)
85 ℃
Operating Temperature (Min)
-25 ℃
Power Dissipation (Max)
560 mW
Supply Voltage
2.7V ~ 6.5V
Supply Voltage (Max)
6.5 V
Supply Voltage (Min)
2.7 V

TDA8024T/C1,118 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Size-Width
7.6 mm
Operating Temperature
-25℃ ~ 85℃

TDA8024T/C1,118 Documents

NXP
29 Pages / 0.16 MByte
NXP
33 Pages / 0.78 MByte

TDA8024 Documents

Philips
IC card interface
NXP
Smart Card Interface 3.2MHz 3.3V/5V 560mW T/R 28Pin SO
NXP
Smart Card Interface 3.2MHz 3.3V/5V 560mW T/R 28Pin TSSOP
NXP
Smart Card Interface 3.2MHz 3.3V/5V 560mW T/R 28Pin SO
NXP
Smart Card Interface 3.2MHz 3.3V/5V 560mW Bulk 28Pin SO
NXP
20MHzSmart Card Interface 5V 560mW 28Pin SO
NXP
Smart Card Interface 3.2MHz 3.3V/5V 560mW T/R 28Pin TSSOP
NXP
Smart Card Interface 3.2MHz 3.3V/5V 560mW 28Pin TSSOP
NXP
3.2MHzSmart Card Interface 3.3V/5V 560mW 28Pin TSSOP
NXP
IC SMART CARD INTERFACE 28-SOIC
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