Part 3D Model

$ 0.402

W25Q128JVSIQ Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

SOIC-8

Description:

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 128M-bit 16M x 8 6ns 8Pin SOIC

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25Q128JVSIQ Datasheet (68 Pages)

Pinout Diagram on8 Page 9 PageHot

Package Outline Dimension on61 Page

Part Numbering System on65 Page

W25Q128JVSIQ Datasheet PDF (68 Pages)

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W25Q128JVSIQ Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

8 Pin

Case/Package

SOIC-8

Clock Speed

133 MHz

Number of Bits

8 Bit

Access Time(Max)

6 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

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W25Q128JVSIQ Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Operating Temperature

-40℃ ~ 85℃ (TA)

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W25Q128JVSIQ Environmental

W25Q128JVSIQ Export Classifications

W25Q128JVSIQ Function Overview

W25Q128JVSIQ Documents

W25Q128JVSIQ Datasheet

Winbond Electronics

68 Pages / 0.87 MByte

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