Part 3D Model

$ 0.617

W25Q64JVZEIQ Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

WDFN-8

Description:

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 6ns 8Pin WSON EP

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25Q64JVZEIQ Datasheet (77 Pages)

Pinout Diagram on6 Page 7 Page 8 Page 10 PageHot

Part Numbering System on75 Page

W25Q64JVZEIQ Datasheet PDF (77 Pages)

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W25Q64JVZEIQ Specifications

TYPE

DESCRIPTION

Number of Pins

8 Pin

Case/Package

WDFN-8

Number of Bits

8 Bit

Access Time(Max)

6 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

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W25Q64JVZEIQ Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Operating Temperature

-40℃ ~ 85℃ (TA)

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W25Q64JVZEIQ Environmental

W25Q64JVZEIQ Export Classifications

W25Q64JVZEIQ Function Overview

W25Q64JVZEIQ Documents

W25Q64JVZEIQ Datasheet

Winbond Electronics

77 Pages / 2.8 MByte

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