Part 3D Model

$ 0.881

W25Q80BLSNIG Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

SOIC-8

Description:

NOR Flash Serial-SPI 2.5V/3.3V 8M-bit 1M x 8 9ns 8Pin SOIC

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25Q80BLSNIG Datasheet (74 Pages)

Pinout Diagram on6 Page 7 Page 8 PageHot

Part Numbering System on72 Page

W25Q80BLSNIG Datasheet PDF (74 Pages)

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W25Q80BLSNIG Specifications

TYPE

DESCRIPTION

Number of Pins

8 Pin

Case/Package

SOIC-8

Supply Current

18 mA

Access Time(Max)

9 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.3V ~ 3.6V

View Datasheet >

W25Q80BLSNIG Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Obsolete

Size-Height

1.5 mm

Operating Temperature

-40℃ ~ 85℃ (TA)

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W25Q80BLSNIG Environmental

W25Q80BLSNIG Function Overview

W25Q80BLSNIG Documents

W25Q80BLSNIG Datasheet

Winbond Electronics

74 Pages / 2.72 MByte

W25Q80BLSNIG Other Datasheet PDF

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65 Pages / 1.96 MByte

W25Q80BLSNIG Features Description Parametrics

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77 Pages / 2.16 MByte

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