Part 3D Model

$ 0.414

W25X10BVSNIG Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

SOIC-8

Description:

NOR Flash Serial-SPI 3.3V 1M-bit 1M x 1 7ns 8Pin SOIC

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W25X10BVSNIG Datasheet (51 Pages)

W25X10BVSNIG Specifications

TYPE

DESCRIPTION

Mounting Style

Surface Mount

Number of Pins

8 Pin

Case/Package

SOIC-8

Number of Bits

1 Bit

Access Time(Max)

7 ns

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

View Datasheet >

W25X10BVSNIG Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Obsolete

Operating Temperature

-40℃ ~ 85℃ (TA)

View Datasheet >

W25X10BVSNIG Environmental

W25X10BVSNIG Export Classifications

W25X10BVSNIG Function Overview

W25X10BVSNIG Documents

W25X10BVSNIG Datasheet

Winbond Electronics

51 Pages / 1.62 MByte

W25X10BVSNIG Other Datasheet PDF

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51 Pages / 1.61 MByte

W25X10BVSNIG Features Description Parametrics

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45 Pages / 1.49 MByte

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W25X10BVSNIG Datasheet PDF

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