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W29N01HVSINA Datasheet PDF - Winbond Electronics

Manufacturer:

Winbond Electronics

Category:

Memory Chip

Case Package:

TFSOP-48

Description:

SLC NAND Flash Parallel 3.3V 1Gbit 128M x 8Bit 25ns 48Pin TSOP

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

W29N01HVSINA Datasheet (54 Pages)

W29N01HVSINA Specifications

TYPE

DESCRIPTION

Number of Pins

48 Pin

Case/Package

TFSOP-48

Number of Bits

8 Bit

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-40 ℃

Supply Voltage

2.7V ~ 3.6V

View Datasheet >

W29N01HVSINA Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

Active

Packaging

Tray

Operating Temperature

-40℃ ~ 85℃ (TA)

View Datasheet >

W29N01HVSINA Environmental

W29N01HVSINA Function Overview

W29N01HVSINA Documents

W29N01HVSINA Datasheet

Winbond Electronics

54 Pages / 1.48 MByte

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W29N01HVSINA Datasheet PDF

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W29N01HVDINA Datasheet PDF

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NAND Flash 3V/3.3V 1G-bit 128M x 8 48Pin VFBGA Tray

W29N01HVBINA Datasheet PDF

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Ic Flash 1gbit 25ns 63vfbga

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