● General
● Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management
● Quick Hardware Design With TI Module Collateral and Reference Designs
● Operating Temperature: -40°C to 85°C Industrial Temperature Grade
● Small Form Factor: 13.3 × 13.4 × 2 mm
● 100-Pin MOC Package
● FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
● Wi-Fi
● WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
● 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)o2.4-GHz MRC Support for Extended Range and 5-GHz Diversity Capable
● Fully Calibrated: Production Calibration Not Required
● 4-Bit SDIO Host Interface Support
● Wi-Fi Direct Concurrent operation (Multichannel, Multirole)
● Blue to oth and BLE (WL1837MOD only)
● Bluetooth 4.1 Compliance and CSA2 Support
● Host Controller Interface (HCI) Transport for Bluetooth over UART
● Dedicated Audio Processor Support of SBC Encoding + A2DP
● Dual-Mode Bluetooth and Bluetooth LE
● TI’s Bluetooth- and LE-Certified Stack
● Key Benefits
● Reduces Design overhead
● Differentiated Use-Cases by Configuring WiLink 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With other Wi-Fi Device son Different RF Channel (Wi-Fi Networks)
● Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With up to 1.4X the Range Versus one Antenna
● Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in one Step
● Lowest Wi-Fi Power Consumption in Connected Idle (
● Configurable Wake on WLAN Filters to Only Wake up the System
● Wi-Fi-Blueto th Single Antenna Coexistence
