$ 31.046

HMC329 Datasheet PDF - ADI

Manufacturer:

ADI

Category:

RF Modules & ICs

Case Package:

Chip

Description:

Up/Down Conv Mixer 40GHz 3Pin Die Tray

Pictures:

3D Model

Symbol

Footprint

Pinout

Product Pictures

Documentation:

HMC329 Datasheet (8 Pages)

Package Outline Dimension on5 Page

HMC329 Datasheet PDF (8 Pages)

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HMC329 Specifications

TYPE

DESCRIPTION

Frequency

25GHz ~ 40GHz

Number of Pins

3 Pin

Case/Package

Chip

Power Dissipation

382 mW

Operating Temperature (Max)

85 ℃

Operating Temperature (Min)

-55 ℃

Power Dissipation (Max)

382 mW

View Datasheet >

HMC329 Size & Package

TYPE

DESCRIPTION

Product Lifecycle Status

End of Life

Packaging

Tray

Size-Height

0.1 mm

Operating Temperature

-55℃ ~ 85℃

View Datasheet >

HMC329 Environmental

HMC329 Export Classifications

HMC329 Function Overview

HMC329 Documents

HMC329 Datasheet

ADI

8 Pages / 0.3 MByte

HMC329 Other Datasheet PDF

ADI

9 Pages / 0.66 MByte

HMC329 Notice File

ADI

17 Pages / 0.25 MByte

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