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Part Datasheet Search > IGBTs > IXYS Semiconductor > IXGK50N60BU1 Datasheet PDF
IXGK50N60BU1
$ 12.335

IXGK50N60BU1 Specifications

TYPE
DESCRIPTION
Mounting Style
Through Hole
Number of Pins
3 Pin
Case/Package
TO-264-3
Power Dissipation
300000 mW
Breakdown Voltage (Collector to Emitter)
600 V
Reverse recovery time
50 ns
Input Power (Max)
300 W
Operating Temperature (Max)
150 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
300000 mW

IXGK50N60BU1 Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Not Recommended for New Designs
Packaging
Tube
Size-Length
19.96 mm
Size-Width
5.13 mm
Size-Height
26.16 mm
Operating Temperature
-55℃ ~ 150℃ (TJ)

IXGK50N60BU1 Documents

IXYS Semiconductor
6 Pages / 0.17 MByte
IXYS Semiconductor
6 Pages / 0.15 MByte

IXGK50N60 Documents

IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 300000mW 3Pin(3+Tab) TO-264AA
IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 300000mW 3Pin(3+Tab) TO-264AA
IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 3Pin(3+Tab) TO-264
IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 480000mW 3Pin(3+Tab) TO-264AA
IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 300000mW 3Pin(3+Tab) TO-264AA
IXYS Semiconductor
Trans IGBT Chip N-CH 600V 75A 3Pin(3+Tab) TO-264AA
IXYS Semiconductor
IGBT 600V 75A 400W TO264AA
IXYS Semiconductor
Low-Frequency Range (DC-15kHz), Low Vcesat w/ Diode
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