●The LSM6DS33 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
●The LSM6DS33 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
●ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
●The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
●The LSM6DS33 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
●High robustness to mechanical shock makes the LSM6DS33 the preferred choice of system designers for the creation and manufacturing of reliable products.
●The LSM6DS33 is available in a plastic land grid array (LGA) package.
●Key Features
● Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
● “Always-on” experience with low power consumption for both accelerometer and gyroscope
● Smart FIFO up to 8 kbyte based on features set
● Compliant with Android K and L
● ±2/±4/±8/±16 g full scale
● ±125/±250/±500/±1000/±2000 dps full scale
● Analog supply voltage: 1.71 V to 3.6 V
● Independent IOs supply (1.62 V)
● Compact footprint, 3 mm x 3 mm x 0.86 mm
● SPI/I2 C serial interface with main processor data synchronization feature
● Embedded temperature sensor
● ECOPACK® , RoHS and “Green” compliant
