●The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
●The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
●The LSM6DS3US gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
●ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
●The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
●The LSM6DS3US has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
●High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products.
●The LSM6DS3US is available in a plastic land grid array (LGA) package.
●Key Features
● Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
● “Always-on” experience with low power consumption for both accelerometer and gyroscope
● Interface flexibility: selectable SPI (3/4-wire) or I2 C with the main processor
● Auxiliary SPI (3-wire) to support OIS applications
● EIS/OIS support
● Accelerometer ODR up to 6.66 kHz
● Gyroscope ODR up to 3.33 kHz
● Smart FIFO
● ±2/±4/±8/±16 g full scale
● ±125/±250/±500/±1000/±2000 dps full scale
● Analog supply voltage: 1.71 V to 3.6 V
● Independent IOs supply (1.62 V)
● Compact footprint, 2.5 mm x 3 mm x 0.83 mm
● SPI/I2 C serial interface data synchronization feature
● Embedded temperature sensor
● ECOPACK® , RoHS and “Green” compliant
Part 3D Model
