●DESCRIPTION
●The MSC1210Yx is a completely integrated family of mixed-signal devices incorporating a high-resolution
●delta-sigma ADC, 8-channel multiplexer, burnout current sources, selectable buffered input, offset DAC
●(Digital-to-Analog Converter), Programmable Gain Amplifier (PGA), temperature sensor, voltage reference,
●8-bit microcontroller, Flash Program Memory, Flash Data Memory, and Data SRAM, as shown in Figure 8.
●FEATURES
●ANALOG FEATURES
●24 Bits No Missing Codes
●22 Bits Effective Resolution at 10Hz
● − Low Noise: 75nV
●PGA From 1 to 128
●Precision On-Chip Voltage Reference
● − Accuracy: 0.2%
● − Drift: 5ppm/°C
●8 Differential/Single-Ended Channels
●On-Chip Offset/Gain Calibration
●Offset Drift: 0.02ppm/°C
●Gain Drift: 0.5ppm/°C
●On-Chip Temperature Sensor
●Burnout Sensor Detection
●Single-Cycle Conversion
●Selectable Buffer Input
●DIGITAL FEATURES
●Microcontroller Core
●8051-Compatible
●High-Speed Core
●− 4 Clocks per Instruction Cycle
●DC to 33MHz
●Single Instruction 121ns
●Dual Data Pointer
●Memory
●Up To 32kB Flash Memory
●Flash Memory Partitioning
●Endurance 1M Erase/Write Cycles, 100 Year Data Retention
●In-System Serially Programmable
●External Program/Data Memory (64kB)
●1,280 Bytes Data SRAM
●Flash Memory Security
●2kB Boot ROM
●Programmable Wait State Control
●Peripheral Features
●34 I/O Pins
●Additional 32-Bit Accumulator
●Three 16-Bit Timer/Counters
●System Timers
●Programmable Watchdog Timer
●Full-Duplex Dual USARTs
●Master/Slave SPI
●16-Bit PWM
●Power Management Control
●Idle Mode Current < 1mA
●Stop Mode Current < 1A
●Programmable Brownout Reset
●Programmable Low Voltage Detect
●21 Interrupt Sources
●Two Hardware Breakpoints
●GENERAL FEATURES
●Pin-Compatible with MSC1211/12/13/14
●Package: TQFP-64
●Low Power: 4mW
●Industrial Temperature Range: −40°C to +85°C
●Power Supply: 2.7V to 5.25V
●APPLICATIONS
●Industrial Process Control
●Instrumentation
●Liquid/Gas Chromatography
●Blood Analysis
●Smart Transmitters
●Portable Instruments
●Weigh Scales
●Pressure Transducers
●Intelligent Sensors
●Portable Applications
●DAS Systems
Part 3D Model
