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Part Datasheet Search > IGBTs > ST Microelectronics > STGB10H60DF Datasheet PDF
STGB10H60DF
$ 0.951
STGB10H60DF Datasheet PDF (24 Pages)
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STGB10H60DF Specifications

TYPE
DESCRIPTION
Mounting Style
Surface Mount
Number of Pins
3 Pin
Case/Package
TO-263-3
Power Dissipation
115000 mW
Breakdown Voltage (Collector to Emitter)
600 V
Reverse recovery time
107 ns
Input Power (Max)
115 W
Operating Temperature (Max)
175 ℃
Operating Temperature (Min)
-55 ℃
Power Dissipation (Max)
115 W

STGB10H60DF Size & Package

TYPE
DESCRIPTION
Product Lifecycle Status
Active
Packaging
Tape & Reel (TR)
Size-Length
10.4 mm
Size-Width
9.35 mm
Size-Height
4.6 mm
Operating Temperature
-55℃ ~ 175℃ (TJ)

STGB10H60DF Documents

ST Microelectronics
24 Pages / 1.68 MByte

STGB10H60 Documents

ST Microelectronics
Trans IGBT Chip N-CH 600V 20A 115000mW 3Pin(2+Tab) D2PAK T/R
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